| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the productivity of a circuit board assembly by efficiently performing preliminary heating without damaging a coloring resin component on a circuit board even when a circuit board preliminary heating temperature is raised. <P>SOLUTION: A soldering board transporting jig 1 is used to hold a circuit board 2 and components 5-10 between upper and lower palettes 3 and 4, form portions 17-21 for shielding a preliminary heating light source 16 on the upper palette 4 in opposition to coloring resin components 5-10 on the circuit board, and make openings 22-24 for allowing a light source to perform irradiation on the upper palette 4 in opposition to a circuit board side except for the coloring resin components. The openings 22 to 24 are made in opposition to terminals 12 and 13 which are solder-connected to the circuit board 2. At least end surfaces 22a-c, 23a-c, 24a-b, and 24'a-b in the openings are formed of a material which reflects light from the light source 16 obliquely downward to the circuit board side. <P>COPYRIGHT: (C)2010,JPO&INPIT |
