| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is easily miniaturized by preventing entry of impurities such as moisture into its active region during both dicing and bonding. <P>SOLUTION: The semiconductor device has tubular dummy wiring which includes an opening through which wiring for connecting semiconductor elements and external connection terminals passes, extends in an insulating film which is arranged on a semiconductor layer including the semiconductor elements, surrounds the whole of the semiconductor elements and is arranged inside the external connection terminals. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
