MICRO ELECTRO MECHANICAL DEVICE PACKAGE AND METHOD OF MANUFACTURING A MICRO ELECTRO MECHANICAL DEVICE PACKAGE

摘要

The present invention relates to a micro electro mechanical device package, comprising: a composite structure comprising a substrate and at least one further layer provided on the substrate, wherein the composite structure comprises a cavity extending from the top surface of the composite structure into the substrate; a micro electro mechanical device provided within the cavity; a transparent plate covering the cavity such that the cavity is hermetically sealed; and package contact pads for electrically contacting the package, wherein the micro electro mechanical device is electrically connected to the package contact pads.