| 摘要 |
PROBLEM TO BE SOLVED: To provide a means for cooling a terminal formation surface which is a rear surface of a semiconductor device as an object to be inspected during inspection. SOLUTION: In a socket having a plurality of relay terminals electrically connected to an electrode terminal of an object to be inspected, a radiation terminal is provided to a mounting portion for the object in a substrate of the socket. The radiation terminal includes a contact surface to be in contact with the terminal formation surface where an electrode terminal of the object is formed, and a protrusion portion protruding from the back surface of the substrate on the side opposite to the mounting portion. The socket is mounted such that the terminal formation surface of the object is in contact with the contact surface of the radiation terminal. COPYRIGHT: (C)2010,JPO&INPIT |
