| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealed semiconductor device whose package is made compact while insulation of a suspension lead is secured, and to provided a method of manufacturing the same. <P>SOLUTION: Semiconductor chips 20 and 22 are mounted on die pads 10 and 12. A lead terminal 16 is disposed apart from the die pad 12. The semiconductor chip 22 and lead terminal 16 are connected by a wire 24. The suspension lead 18 is connected to the die pad 10. The die pads 10 and 12, the semiconductor chips 20 and 22, and a part of the lead terminal 16, the wire 24, and a part of the suspension lead 18 are sealed with mold resin 30. The lead terminal 16 projects outward from a side face of the mold resin 30. A cut 36 is formed on the side face of the mold resin 30. The cut 36 is narrower at an opening-side part 42 than at an inner part 44. The suspension lead 18 projects out of the mold resin 30 from the inner part of the cut 36. <P>COPYRIGHT: (C)2010,JPO&INPIT |
