| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lead frame assembly for mounting a light emitting diode chip whose design flexibility is increased by designing a structure of easy dissipation to increase the efficiency of light emission and life, and by reducing a thickness of a terminal to design a light emitting diode which can be used as a various use. <P>SOLUTION: The lead frame assembly for mounting a light emitting diode and its method for manufacturing are used to manufacture a light emitting diode and can increase the dissipation performance and design flexibility. The lead frame assembly for mounting a light emitting diode chip includes a first lead frame portion, a second frame portion which is located at a fixed distance apart from the first lead frame portion, and package portions which are formed between the first lead frame and second lead frame and on the side so that part of an upper surface and lower surface are exposed at the same time. <P>COPYRIGHT: (C)2010,JPO&INPIT |
