发明名称 |
Field mounting-type test apparatus and method for testing memory component or module in actual PC environment |
摘要 |
Provided are a field mounting-type test apparatus and method, which can enhance competitiveness of a product by simulating various test conditions including a mounting environment so as to improve quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment so as to reduce testing time and cost. In accordance with example embodiments, the field mounting-type test apparatus may include a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT by using the logic data.
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申请公布号 |
US2009300442(A1) |
申请公布日期 |
2009.12.03 |
申请号 |
US20090320919 |
申请日期 |
2009.02.09 |
申请人 |
SAMSUNG ELECTRONICS CO. |
发明人 |
CHOI IN-HO;CHOI WOON-SUP;KIM SUNG-YEOL;KWAK YOUNG-KI;LEE JAE-IL;JANG CHUL-WOONG;YOO HO-SUN;YANG IN-SU;JANG SEUNG-HO |
分类号 |
G11C29/04;G01R31/3177;G06F11/22;G06F11/25 |
主分类号 |
G11C29/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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