发明名称 Field mounting-type test apparatus and method for testing memory component or module in actual PC environment
摘要 Provided are a field mounting-type test apparatus and method, which can enhance competitiveness of a product by simulating various test conditions including a mounting environment so as to improve quality reliability of a memory device and by minimizing overall loss due to change in a mounting environment so as to reduce testing time and cost. In accordance with example embodiments, the field mounting-type test apparatus may include a mass storage device configured to store logic data simulating a mounting environment of a device under test (DUT) and a tester main frame configured to test the DUT by using the logic data.
申请公布号 US2009300442(A1) 申请公布日期 2009.12.03
申请号 US20090320919 申请日期 2009.02.09
申请人 SAMSUNG ELECTRONICS CO. 发明人 CHOI IN-HO;CHOI WOON-SUP;KIM SUNG-YEOL;KWAK YOUNG-KI;LEE JAE-IL;JANG CHUL-WOONG;YOO HO-SUN;YANG IN-SU;JANG SEUNG-HO
分类号 G11C29/04;G01R31/3177;G06F11/22;G06F11/25 主分类号 G11C29/04
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