| 摘要 |
<p>A structure for mounting a heat-generating component includes a circuit board on which a heat-generating component is mounted, a base on which the circuit board is disposed upright, a cover having thermal conductivity, a heat-conductive member electrically isolated from the heat-generating component and a heat transfer plate. The heat transfer plate is attached to the circuit board so as to extend in the sliding direction of the cover to cover a surface of the heat-conductive member. The cover presses the heat transfer plate by an inner surface thereof against the heat-conductive member in a direction perpendicular to the heat-conductive member so that the heat-generating component is thermally connected to the inner surface of the cover through the heat-conductive member and the heat transfer plate.</p> |
