发明名称 METHOD FOR CONNECTING AT LEAST ONE CHIP TO A REWIRING ARRANGEMENT
摘要 <p>An electrically conductive connection is produced between a chip and an external wiring configuration that is kept at a distance from the chip by spacers. Electrically conductive contact material is introduced into recesses in the external wiring configuration in order to produce the electrically conductive connection. This can be carried out economically, and allows a mechanically very robust electrical connection from the chip pads to the external wiring planes.</p>
申请公布号 EP1266403(B1) 申请公布日期 2009.12.02
申请号 EP20010935935 申请日期 2001.03.22
申请人 QIMONDA AG I.IN. 发明人 HAUSER, CHRISTIAN;REISS, MARTIN;WINDERL, JOHANN
分类号 H01L21/60;H01L23/31 主分类号 H01L21/60
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