MOUNTING METHOD FOR SEMICONDUCTOR ELEMENT

摘要

PROBLEM TO BE SOLVED: To improve a connection reliability between a bump electrode provided at a cornet part of a semiconductor element and a wiring electrode of a facing circuit board, by preventing occurrence of warping of the semiconductor element and circuit board, related to amounting method for a semiconductor element which uses an anisotropic conductive bond used for various electronic devices. SOLUTION: At connecting of bump electrodes of a semiconductor element 1 to a wiring electrode of a facing circuit board 2 through an anisotropic conductive bond 3 by thermocompression bonding, a part except for a semiconductor element mounting position of the circuit board 2 is thermocompression bonded with a press-fitting tool 5 from above the semiconductor element 1. Thus, warping of the semiconductor element 1 and circuit board 2 is eliminated for improved connection reliability between the semiconductor element 1 and the circuit board.