发明名称 |
Semiconductor device and method of producing the same |
摘要 |
A semiconductor device includes a semiconductor chip having a first main surface having an electrode pad in an exposed state, and an interlayer insulation layer formed on the first main surface so that the electrode pad is partially exposed; a re-distribution wiring layer including a wiring pattern having a linear portion having one end portion electrically connected to the electrode pad and extending from the electrode pad, and a post electrode mounting portion with a recessed polygonal shape and connected to the other end portion of the linear portion; a post electrode formed on the post electrode mounting portion and having a bottom surface with a contour crossing an upper contour of the post electrode mounting portion at more than two points; a sealing portion disposed so that a top of the post electrode is exposed; and an outer terminal formed on the top of the post electrode.
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申请公布号 |
US7626271(B2) |
申请公布日期 |
2009.12.01 |
申请号 |
US20070826119 |
申请日期 |
2007.07.12 |
申请人 |
OKI SEMICONDUCTOR CO., LTD. |
发明人 |
WATANABE KIYONORI |
分类号 |
H01L23/48;H01L23/52;H01L29/40 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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