发明名称 CAMERA MODULE PACKAGE
摘要 PURPOSE: A camera module package manufacture by laser fuse is provided to reduce noise generation about an image sensor by blocking the starry light from being infiltrated to the inner structure of housing. CONSTITUTION: A housing(110) is manufactured by a laser light transparency molding material. A substrate in which the image sensor is mounted is combined to the lower side of the housing. A lens barrel(130) inserted to the housing includes light absorption material. An infrared ray blocking filter(150) on the bottom part of the lens barrel blocks the infrared ray. A shield case(140) is closely connected in the outer circumference of the housing.
申请公布号 KR20090122593(A) 申请公布日期 2009.12.01
申请号 KR20080048479 申请日期 2008.05.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM SO RIM;LEE, DONG KYUN
分类号 H04N5/225 主分类号 H04N5/225
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