| 摘要 |
The present invention provides a semiconductor device, including: a first semiconductor chip, and a second semiconductor chip connected to the first semiconductor chip through a plurality of bumps having not only a number of main bumps necessary for operation between the chips but also a predetermined number of measurement and control input bumps. Each of the first and second chips includes a plurality of measurement path switches individually connected to the main bumps, a plurality of current path switches connected to connecting points between the main bumps and the measurement path switches, and a control circuit for the measurement path switches, the first semiconductor chip further including a plurality of measurement and control terminals for inputting a control signal of the control circuit and supplying fixed current to be supplied to the current path switches and then measuring the voltage at the connecting points.
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