发明名称 Method of manufacturing a substrate-free flip chip light emitting diode
摘要 A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second electrode disposed on another portion of the epitaxial layer, and a protection layer, disposed over the epitaxial layer. It is noted that in the LED device, the substrate comprises, for example but not limited to, high heat-sink substrate, and the protection layer comprises, for example but not limited to, high heat-sink, high transparent material.
申请公布号 US7625778(B2) 申请公布日期 2009.12.01
申请号 US20050148606 申请日期 2005.06.08
申请人 CHUNGHWA PICTURE TUBES, LTD. 发明人 CHEN CHING-CHUNG
分类号 H01L21/44;H01L29/06 主分类号 H01L21/44
代理机构 代理人
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