WAFER DEFECT ANALYZING DEVICE AND CONTROL METHOD FOR THE SAME

摘要

PURPOSE: A wafer defect analyzing device and a control method for the same are reduce a time of analyzing a wafer defect by making wafer defect analysis automation. CONSTITUTION: In a wafer defect analyzing device and a control method for the same, a magazine(10) receives a plurality of wafers. A transfer apparatus(50) extracts at least one wafer from a magazine and transfers it to the predetermined position. The ion extraction unit(21) receives an electrolyte, and ion extraction is performed by the electrolyte. A wafer defect decoradar(20) includes a decoration unit(22) equipped with a heater. A cleaning and drying apparatus(30) perform washing and drying of a wafer. A data storage module analyzes the defect on wafer surface and stores it.