| 摘要 |
The device has a fuse thermally coupled to a zener diode (13) and constituted of a copper metallization (12) that is formed on a semiconductor chip (10) of the zener diode. The semiconductor chip is connected to a metallic track (15) of a printed circuit (11) by a stud (14) and to another metallic track (17) of the printed circuit by a stud (16). A connection point of the metallization and the zener diode is connected to a third stub. |
