发明名称 MULTILAYER PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRODUCTION METHOD OF ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board in which a multi-layered flexible part having a signal wire is constituted to control an impedance while maintaining flexibility. <P>SOLUTION: In this multilayer printed wiring board, in an outer or inner layer part of a plurality of rigid substrate parts 12a, 12b, a flexible substrate part 13 provided extending over the plurality of rigid substrate parts 12a, 12b so as to connect the plurality of rigid substrate parts 12a, 12b is constituted comprising signal layers l6, l12 for sending signals between the plurality of rigid substrate parts 12a, 12b, ground layers l3, l9, l15 individually formed in both sides of the signal layers l6, l12, and intermediate layers l4, l5, l7, l8, l10, l11, l13, l14 formed between the ground layer l3 in the above both sides and the signal layer l6, between the signal layer l6 and the ground layer l9 in the above both sides, between the ground layer l9 and the signal layer l12, or between the signal layer l12 and the ground layer l15 in the above both sides. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009277692(A) 申请公布日期 2009.11.26
申请号 JP20080124723 申请日期 2008.05.12
申请人 FUJITSU LTD 发明人 SUGANE MITSUHIKO;NISHIDA KAZUYA;OKADA AKIRA
分类号 H05K3/46 主分类号 H05K3/46
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