EPOXY RESIN COMPOSITION AND ELECTRONIC PART

摘要

The epoxy resin of the invention comprises (A) an epoxy resin, (B) at least one member selected from the group consisting of a phenolic hydroxyl group-containng compound, a urea resin and a melamine resin, (C) a crosslinked phenoxyphosphazene compound, and (D) an inorganic filler powder, the amount of component (C) being in the range of 0.01 to 30 wt.% based on the total amount of components (A), (B) and (C), and the amount of component (D) being in the range of 60 to 98 wt. % based on the total amount of components (A), (B), (C) and (D), wherein the inorganic filler is a pyrogenically produced silica, which has been hydrophobized with Hexamethyldisilazane (HMDS) and then structurally modified by a ball mill.