发明名称 IMPROVEMENTS RELATING TO DIRECT WRITE AND ADDITIVE MANUFACTURING PROCESSES
摘要 A Direct Write method of forming components on a substrate by deposition of inkby thermally curing the inkinsitu, whichmethod overcomes the need for curing byplacingthe substrate in anoven. The curing is performed in a preferred embodiment using an induction coil (6) through which an oscillating current is passed. The coil (6) is placed above the region in which Direct Write ink has been deposited. The oscillating current induces eddy currents in the inktocause heating of the inkand thus fix the ink by curing, sinteringetc.
申请公布号 WO2008146047(A3) 申请公布日期 2009.11.26
申请号 WO2008GB50390 申请日期 2008.05.30
申请人 BAE SYSTEMS PLC;SIDHU, JAGJIT;MCDONALD, JENNIFER, LAURA 发明人 SIDHU, JAGJIT;MCDONALD, JENNIFER, LAURA
分类号 H05K3/22;B29C67/00;B41M7/00;H05K3/12 主分类号 H05K3/22
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