发明名称 |
IMPROVEMENTS RELATING TO DIRECT WRITE AND ADDITIVE MANUFACTURING PROCESSES |
摘要 |
A Direct Write method of forming components on a substrate by deposition of inkby thermally curing the inkinsitu, whichmethod overcomes the need for curing byplacingthe substrate in anoven. The curing is performed in a preferred embodiment using an induction coil (6) through which an oscillating current is passed. The coil (6) is placed above the region in which Direct Write ink has been deposited. The oscillating current induces eddy currents in the inktocause heating of the inkand thus fix the ink by curing, sinteringetc. |
申请公布号 |
WO2008146047(A3) |
申请公布日期 |
2009.11.26 |
申请号 |
WO2008GB50390 |
申请日期 |
2008.05.30 |
申请人 |
BAE SYSTEMS PLC;SIDHU, JAGJIT;MCDONALD, JENNIFER, LAURA |
发明人 |
SIDHU, JAGJIT;MCDONALD, JENNIFER, LAURA |
分类号 |
H05K3/22;B29C67/00;B41M7/00;H05K3/12 |
主分类号 |
H05K3/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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