SUBSTRATE FOR POWER MODULE, POWER MODULE, AND METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for power module which ensures high bonding strength of a metal plate and a ceramic substrate, and to provide a substrate for power module and a power module using this substrate for power module.

SOLUTION: In a substrate for power module where metal plates 12 and 13 consisting of pure aluminum are bonded to the surface of a ceramic substrate 11 consisting of AlN by means of a soldering material containing silicon, a high concentration portion 32 where the concentration of silicon is set higher by a factor of≥5 times than that of the metal plates 12 and 13 is formed on the bonding interface 30 of the metal plates 12, 13 and the ceramic substrate 11.

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