| 摘要 |
PROBLEM TO BE SOLVED: To attain thickness reduction and cost reduction in a piezoelectric device in which electronic components such as a semiconductor circuit element are joined to a piezoelectric vibrator via a relay board. SOLUTION: An IC chip 30 is joined to the piezoelectric vibrator sealed by joining a crystal vibration chip 20 in a package 10 via the relay board 50. The relay board 50 includes: IC connection terminals 55a, 55b provided on an insulating base material 51; first through-holes 63a, 63b for connection pierced through the insulating base material 51 directly under the IC connection terminals; and external terminals 57a, 57b on the side of the relay board. The IC chip 30 is connected to the IC connection terminals 55a, 55b exposed from the first through-holes 63a, 63b for connection of the relay board 50 via a bump 95. Then, external terminals 15a, 15b on the side of the vibrator provided on the bottom surface side of the package 10, and the external terminals 57a, 57b on the side of the relay board of the relay board 50 are joined to each other via a joining member 91. COPYRIGHT: (C)2010,JPO&INPIT
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