发明名称 Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same
摘要 A structure for blocking electromagnetic interference (EMI) may include at least one electromagnetic wave inducing member and an electromagnetic wave filtering member. The at least one electromagnetic wave inducing member may be provided to an electronic device to induce an electromagnetic wave applied to the electronic device. The electromagnetic wave filtering member may be provided to the electronic device to filter the electromagnetic wave induced by the at least one electromagnetic wave inducing member. Thus, the electromagnetic wave filtering member may remove the electromagnetic wave concentrated on the at least one electromagnetic wave inducing member, so that the electromagnetic wave applied to the electronic device may be effectively removed. As a result, circuits in the electronic device may be protected from the EMI.
申请公布号 US2009290320(A1) 申请公布日期 2009.11.26
申请号 US20090453720 申请日期 2009.05.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 SONG EUN-SEOK
分类号 H05K9/00;H01L23/552;H05K1/02 主分类号 H05K9/00
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