| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an LED substrate in which deterioration (distortion) in flatness of the LED substrate is prevented by heating and cooling in a production process. <P>SOLUTION: In the LED substrate device provided with: a long-length bare board 9 in which a solid pattern is formed at the surface and a wiring pattern with the same width dimensions is formed at the rear surface; and an LED array chip fixed on the solid pattern so as to be a straight-line shape or a staggered shape, the wiring pattern 16 is divided into three or more groups, and are arranged at equal intervals in the shortage direction of the bare board 9 in the group. A dummy pattern 21 is formed along the longitudinal direction of the bare board 9 at the part in which the wiring pattern is not formed in the area of the rear face 11 corresponding to the solid pattern formed at the surface. The width dimensions of the dummy pattern 21 are the same as the width dimensions of the wiring pattern, and the dummy pattern 21 is formed at the same intervals as the intervals of the wiring pattern to the shortage direction of the bare board 9. <P>COPYRIGHT: (C)2010,JPO&INPIT |
