| 发明名称 |
ADHESIVE COMPOSITION, ADHESIVE FILM, AND SEMICONDUCTOR DEVICE |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive composition for bonding an electronic part such as a semiconductor element to a lead frame or an insulation supporting substrate and durable to the thermal history of the high-temperature soldering upon mounting and provide an adhesive film and a semiconductor device. <P>SOLUTION: The adhesive composition comprises a resin and a filler. The filler has a spherical form having an average particle diameter of 10μm or less and a maximum particle diameter of 25μm or less. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2009275229(A) |
申请公布日期 |
2009.11.26 |
| 申请号 |
JP20090188711 |
申请日期 |
2009.08.17 |
| 申请人 |
HITACHI CHEM CO LTD |
发明人 |
MASUKO TAKASHI;HASEGAWA YUJI;AICHI KATSUHIDE |
| 分类号 |
C09J201/00;C09J7/00;C09J9/02;C09J11/04;C09J11/06;C09J163/00;C09J179/08;C09J183/10;H01L21/52 |
主分类号 |
C09J201/00 |
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