| 摘要 |
PROBLEM TO BE SOLVED: To peel a tape in a short time without manually peeling the tape from an end in a method of manufacturing a molded package wherein the tape is peeled off one surface of a lead frame after the other surface side of the lead frame is sealed with a mold resin in a state where the tape is stuck onto the one surface side of the lead frame. SOLUTION: A through-hole 13 is formed at a part of the lead frame 10 where the one surface 11 is coated with the tape 200 and the other surface 12 is not sealed with the resin, and the tape 200 is stuck onto the one surface 11 of the lead frame 10 to close the through-hole 13. Then, the other surface 12 of the lead frame 10 is sealed with the mold resin 20 not to close the through-hole 13, and further a pin 300 is inserted into the through-hole 13 from the side of the other surface 12 of the lead frame 10 to push up the tape 200 with the pin 300, thereby the tape 200 is peeled off. COPYRIGHT: (C)2010,JPO&INPIT |
