| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that saves a space as compared with use of a semiconductor chip having a sensor formed in one body while the sensor detects the temperature of a semiconductor chip mounted on a circuit pattern of a ceramic substrate more precisely than a conventional external sensor. SOLUTION: A support plate 35 is fixed to a support frame 30 with a screw 36, and the temperature sensor 34 is engaged with and fixed to a tip of the support plate 35. A leaf spring is used as the support plate 35. The temperature sensor 34 has a thermistor built in a metallic cylindrical case 37 with good thermal conductivity, and is sealed with an electric insulating material with good thermal conductivity. A signal line 38 is led out of the cylindrical case 37. The temperature of the semiconductor chip 23 is detected in a state that a tip of the cylindrical case 37 is pressed against a ceramic substrate 21. COPYRIGHT: (C)2010,JPO&INPIT |
