| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for manufacturing an electronic component, wherein even when sheet resin subjected to much solvent volatilization is used, high resin filling can be obtained, damage to a bonding portion of a mounted element can be suppressed, and void generation is suppressed. <P>SOLUTION: In "a sheet resin lamination process", a separator 22, a mounting substrate 23 and sheet resin 24 are laminated on a metallic base plate 21 in the order, a separator 25 is further arranged on the laminate and the laminate is inserted into a pack 30 to prepare a substrate-included pack 50. In "a solvent volatilization process", the substrate-included pack 50 is set on a heating stage of a laminate heating device, depressurized and heated up to a temperature less than a curing temperature of the sheet resin 24 to volatilize a solvent in the sheet resin. In "a resin filling and sealing process", the pack 30 is sealed to seal up the laminate pack, and then a vacuum chamber is opened to return pressure in the pack 30 to an atmosphere. Then, the pack 30 is heated as it is to practically cure the sheet resin. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
