| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating sheet (for electronic apparatuses and electronic parts) which is thin and exhibits high heat dissipation characteristics and excellent electric insulation, and to provide its manufacturing method. SOLUTION: The heat dissipating sheet is composed of alumina particles which are bound by binder resin with glass-transition temperature of -50 to 50°C. The mass ratio between the alumina particles and the binder resin is 70/30 to 91/9, and the thickness of the sheet is 50-150μm. The sheet is formed by dissolving the binder resin in a solvent, homogeneously and finely dispersing the alumina particles in the solution, spreading the liquid, and drying it. COPYRIGHT: (C)2006,JPO&NCIPI
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