发明名称 |
Component mounting apparatus with pivotable transfer mechanism |
摘要 |
Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.
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申请公布号 |
US7621039(B2) |
申请公布日期 |
2009.11.24 |
申请号 |
US20050174167 |
申请日期 |
2005.07.01 |
申请人 |
SAMSUNG TECHWIN CO., LTD. |
发明人 |
LEE TAE-YOUNG;HWANG YOUNG-SOO |
分类号 |
H05K3/30 |
主分类号 |
H05K3/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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