发明名称 Component mounting apparatus with pivotable transfer mechanism
摘要 Provided is a component mounter. The component mounter comprises: a bed; a component supply unit; a conveyor transferring at least one PCB to a specified mounting position; a plurality of head units having at least one nozzle for picking up the electronic component from the component supply unit and for mounting it to the PCB; first and second Y axis transfer mechanisms; an X axis transfer mechanism having a first end of mounted to the first Y axis transfer mechanism and the second end mounted to the second Y axis transfer mechanism; a first driving unit controlling the movement of the first end of the X axis transfer mechanism along Y axis; and a second driving unit controlling the movement of the second end of the X axis transfer mechanism along the Y axis, independently of the first driving unit.
申请公布号 US7621039(B2) 申请公布日期 2009.11.24
申请号 US20050174167 申请日期 2005.07.01
申请人 SAMSUNG TECHWIN CO., LTD. 发明人 LEE TAE-YOUNG;HWANG YOUNG-SOO
分类号 H05K3/30 主分类号 H05K3/30
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