| 摘要 |
A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the opening portion by an electroplating, removing the plating resist, wet-etching the seed layer using the copper plating layer as a mask to obtain the wiring layer, roughening a surface of the wiring layer by a blackening process, and forming an insulating layer on the wiring layer, wherein a surface of the copper plating layer is soft-etched simultaneously in the step of etching the seed layer, whereby a soft etching step of the wiring layer carried out prior to the step of the blackening process is omitted.
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