| 摘要 |
A disclosed electrolytic plating method includes a first step of immersing a substrate in electrolytic plating liquid including copper salt to form a first Cu layer on the substrate; and a second step of forming a second Cu layer over the first Cu layer. The first step is continued for ten seconds or less after the immersion. In the first step, the substrate is rotated at a first speed N (rpm) which satisfies DxNxn<=6000xpi (mm/min), where D is the diameter of the substrate (mm), and DxNxpi represents the peripheral speed of the substrate, and a current is supplied to the substrate at a first density of 10 mA/cm2 or less. In the second step, the substrate is rotated at a second speed higher than the first speed, and the current is supplied to the substrate at a second density higher than the first density.
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