发明名称 Semiconductor Device and Method of Forming High Voltage SOI Lateral Double Diffused MOSFET with Shallow Trench Insulator
摘要 A semiconductor device has a buried oxide layer formed over a substrate. An active silicon layer is formed over the buried oxide layer. A drain region is formed in the active silicon layer. An LDD drift region is formed in the active silicon layer adjacent to the drain region. The drift region has a graded doping distribution. A co-implant region is formed in the active silicon. A source region is formed in the co-implant region. A shallow trench insulator is formed along a top surface of the LDD drift region. The shallow trench isolator has a length less than the LDD drift region. The shallow trench insulator terminates under the polysilicon gate and within the LDD drift region. A polysilicon gate is formed above the active silicon layer between the source region and LDD drift region and at least partially overlapping the shallow trench insulator.
申请公布号 US2009283826(A1) 申请公布日期 2009.11.19
申请号 US20090467157 申请日期 2009.05.15
申请人 GREAT WALL SEMICONDUCTOR CORPORATION 发明人 SHEA PATRICK M.;ANDERSON SAMUEL J.;OKADA DAVID N.
分类号 H01L29/78;H01L21/336 主分类号 H01L29/78
代理机构 代理人
主权项
地址