| 摘要 |
A substrate supporting mechanism includes a function for heating a substrate placed thereon in a process container of a substrate processing apparatus. The substrate supporting mechanism includes a worktable configured to place the substrate thereon and including a heating element made of silicon carbide and formed in a predetermined pattern; an electric feeder electrode configured to supply electricity to the heating element; and a partition member made of an electrically insulating material and interposed between portions adjacent to each other in the heating element formed in the predetermined pattern.
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