| 摘要 |
The thermally conductive resin material of the present invention has an excellent thermal conductive property without impairing the intrinsic practical properties such as the forming processability, lightness in weight and mechanical strength possessed by resins and has an anisotropic thermal conductive property capable of controlling the directionality and the transfer amount of the thermal conduction. The thermally conductive resin material of the present invention is a thermally conductive resin material including a base material of a thermoplastic resin (A) and a fibrous filler (C), wherein an organic compound (B) incompatible with the resin component is present as dispersed particles in the resin component, and two or more elements of the fibrous filler (C) are in contact with the surface of each of the dispersed particles or are located in each of the dispersed particles.
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