| 摘要 |
PROBLEM TO BE SOLVED: To provide: a thermosetting resin composition capable of forming a hole insulating layer excellent in insulation reliability, heat resistance, etc. without having problems such as causing cracks formed inside the hole insulating layer and delamination induced at periphery of the hole insulating layer under high temperature conditions in a hardening treatment or solder leveling; and a printed wiring board using the same. SOLUTION: The thermosetting resin composition for filling holes 3 in the printed wiring board 1 comprises (A) an epoxy resin, (B) an epoxy resin hardener, and (C) an inorganic filler. The epoxy resin (A) comprises a bifunctional epoxy resin (A-1) and an epoxy resin with three of more functionalities (A-2), and the inorganic filler (C) comprises a salt of an element of group IIa of the periodic table. Preferably, the epoxy resin (A) is a mixture prepared by dissolving the epoxy resin (A-2) with three or more functionalities in the liquid bifunctional epoxy resin (A-1), and has a viscosity at 25°C of 5-100 dPa s after their dissolution. COPYRIGHT: (C)2010,JPO&INPIT
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