| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a bonded substrate having a favorable thin film over an entire substrate surface, especially even in the vicinity of a bonded end. SOLUTION: The method for manufacturing the bonded substrate includes, at least a step to form an ion implanted layer by implanting hydrogen ions or rare gas ions or both types of the ions to a surface of a first substrate being a semiconductor substrate, a step to execute surface activation treatment on at least one of the first substrate ion-implanted surface and a bonding surface of a second substrate, a bonding step to bond the first substrate ion-implanted surface and the bonding surface of the second substrate at an atmosphere of humidity 30% or lower and/or water content 6 g/m<SP>3</SP>or smaller, and an exfoliating step to transform the first substrate into a thin film by removing the first substrate at the ion-implanted layer, thus manufacturing the bonded substrate having the thin film on the second substrate. COPYRIGHT: (C)2010,JPO&INPIT
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