Electronic component comprises semiconductor module and printed circuit board which is arranged above semiconductor module, where electrically conductive spring element is provided between semiconductor module and printed circuit board

摘要

The electronic component (1) comprises a semiconductor module (2) and a printed circuit board (3) which is arranged above the semiconductor module. An electrically conductive spring element (4) is provided between the semiconductor module and the printed circuit board for producing an electrical contact. The spring element is connected with a support part (6) which is mounted at upper side (7) of the printed circuit board. The spring element penetrates a recess (8) in the printed circuit board.