| 摘要 |
PURPOSE: A pipe unit of a semiconductor manufacturing device is provided to increase thermal transfer efficiency by directly heating a pipe unit through a heating coil. CONSTITUTION: A pipe unit of a semiconductor manufacturing device includes an inner tube, a heating coil, an insulation member, an inner insulation member, an outer insulation member, and a heat dissipation tube. The inner tube(10) exhausts a plurality of chemical gases generated in a process for manufacturing a semiconductor device. The heating coil(30) is formed in an outer side of the inner tube in order to heat the inner tube. The insulation member(50) prevents effluence of a heat generated in the heating coil. The inner insulation member(20) is installed between the inner tube and the heating coil in order to prevent a short-circuit of the inner tube and the heating coil. The outer insulation member(40) is installed between the heating coil and the insulation member in order to prevent a short-circuit of the heating coil and the insulation member. The heat dissipation tube(60) surrounds the insulation member.
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