| 摘要 |
<p>PURPOSE: A method for molding a semiconductor package is provided to reduce an initial investment cost for setup by using a side gate compression mold. CONSTITUTION: A plurality of semiconductor package regions is divided according to a horizontal direction and a vertical direction. A semiconductor chip is attached to a semiconductor chip attaching region among each semiconductor package region of a substrate. A bonding pad of the semiconductor chip is connected to a conductive pattern for wire bonding through a wire. A tape is attached to an edge part including a ball land for laminating among each semiconductor package region of the substrate. A resin is molded on a whole top surface of the substrate including the semiconductor chip, the wire, and the tape(600). A molding resin is removed in order to expose the tape. The ball land for laminating is exposed to outside by removing the tape which covers the edge part including the ball land part for laminating.</p> |
