发明名称 ELECTRICAL CONNECTION OF A SUBSTRATE WITHIN A VACUUM DEVICE VIA ELECTRICALLY CONDUCTIVE EPOXY/PASTE
摘要 An image intensifier (50) includes a microchannel plate (MCP) having an output surface (62), and a ceramic substrate (60) having an outer surface (58). The output surface (62) of the MCP and the outer surface (58) of the ceramic substrate (60) are oriented facing each other. An imager (56) is substantially buried within the ceramic substrate (60), and an input surface (57) of the imager (56) is exposed to receive electrons from the output surface (62) of the MCP. The input surface (57) of the imager (56) and the outer surface (58) of the ceramic substrate (60) are oriented in substantially the same plane. The input surface (57) of the imager (56) and the outer surface (58) of the ceramic substrate (60) are disposed at a very close distance from the output surface (62) of the MCP. The imager (56) includes input/output pads (62), and the ceramic substrate (60) includes input/output pads (61). A conductive epoxy (45a,45b) connects a respective input/output pad (62) of the imager (56) to a respective input/output pad (61) of the ceramic substrate (60).
申请公布号 IL196831(D0) 申请公布日期 2009.11.18
申请号 IL20090196831 申请日期 2009.02.01
申请人 ITT MANUFACTURING ENTERPRISES, INC. 发明人
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