发明名称
摘要 PROBLEM TO BE SOLVED: To improve, in particular efficiency of mass production of a light- emitting diode, to make thinner as the light-emitting diode, and to make color tone of the light-emitting diode closer to desired color tone, by forming a recessed part by a coining work where a substrate is thrust with a protruding- shaped punch. SOLUTION: A substrate is formed, in such a that a metal piece acting as a lead electrode is placed in a metal mold before liquid crystal polymer is injected to insert-form and then is taken out after cooling. Then a recessed part for placing an LED chip on the formed substrate is formed by coining work. Multiple protruding-shaped punches 27, standing in a row are dropped toward heated substrates 21 to form recessed shapes 23 by thrusting, and then the punches are returned right above. By sending multiple substrates 21 standing in a row before cutting into each under the punches in the order, efficiency of forming the recessed part on the substrate 21 is improved by for.
申请公布号 JP4366767(B2) 申请公布日期 2009.11.18
申请号 JP19990202251 申请日期 1999.07.15
申请人 发明人
分类号 H01L33/32;H01L33/56;H01L33/60 主分类号 H01L33/32
代理机构 代理人
主权项
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