发明名称 |
PRESSURE-SENSITIVE ADHESIVE COMPOSITIONS, PRESSURE-SENSITIVE ADHESIVE FILMS, DICING DIE-BONDING FILMS AND SEMICONDUCTOR WAFERS COMPRISING THE SAME |
摘要 |
PURPOSE: A pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, a dicing die-bonding film and a semiconductor wafer comprising the same are provided to suppress the change of releasability of a dicing film and die-bonding film after a long-term storage at a room temperature or high temperature. CONSTITUTION: A pressure-sensitive adhesive composition comprises a base resin and a photoinitiator with a melting point of 70°C. The base resin is an acrylic copolymer with average molecular weight with 200,000 -1,500,000. The acrylic copolymer includes an acrylic acid ester-based monomer and a cross-linkable functional group-containing monomer. An adhesive film includes an adhesive layer containing the adhesive composition. |
申请公布号 |
KR20090118806(A) |
申请公布日期 |
2009.11.18 |
申请号 |
KR20080093218 |
申请日期 |
2008.09.23 |
申请人 |
LG CHEM. LTD. |
发明人 |
JOO, HYO SOOK;CHO, HYUN JU;PARK, HYO SOON;KIM, JANG SOON;PARK, YONG SU;HONG, JONG WAN |
分类号 |
C09J7/00;C09J133/08 |
主分类号 |
C09J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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