| 摘要 |
<p>In a method for manufacturing a multilayer ceramic substrate in which after firing is performed while restriction layers which are not sintered in the firing are disposed on primary surfaces of an unsintered ceramic laminate, the restriction layers are removed, when a bonding force generated by each restriction layer is increased, the restriction layers cannot be easily removed, and when the restriction layers are designed to be easily removed, the bonding force decreases. In an unsintered ceramic laminate (12), conductive patterns (5 to 9) containing Ag as a primary component are formed, and in addition, at least one first base layer (1) and at least one second base layer (2) are also laminated to each other. The second base layer (2) is disposed along at least one primary surface of the unsintered ceramic laminate (12), and restriction layers (10, 11) are disposed so as to be in contact with the second base layers (2). The second base layer (2) is formed to have a composition so that Ag is likely to diffuse in firing as compared to that of the first base layer, and as a result, the glass softening point decreases; hence, a restriction force is improved without using means for decreasing the particle diameter of a sintering resistant ceramic powder contained in the restriction layers.</p> |
