发明名称 |
HEAT DISSIPATING STRUCTURE BASE BOARD, MODULE USING HEAT DISSIPATING STRUCTURE BASE BOARD, AND METHOD FOR MANUFACTURING HEAT DISSIPATING STRUCTURE BASE BOARD |
摘要 |
<p>The present invention relates to a heat dissipation structure board and a module using this heat dissipation structure used for purpose required of high reliability such as a hybrid vehicle or an electric vehicle and to a method of manufacturing the heat dissipation structure. A resin structure is disposed on a lead frame constituting a heat dissipation board and an odd-shaped electronic component or the like mounted on this lead frame or the like to cover up the lead frame and the odd-shaped electronic component or the like, and this resin structure is fixed to a metal plate, a chassis of a device and the like to constitute the heat dissipation structure board as a whole, whereby fixing strengths of fixing the lead frame and the odd-shaped electronic component or the like, a bonding strength at an interface between the lead frame and the heat transfer layer and the like can be reinforced.</p> |
申请公布号 |
EP2120263(A1) |
申请公布日期 |
2009.11.18 |
申请号 |
EP20080854096 |
申请日期 |
2008.11.28 |
申请人 |
PANASONIC CORPORATION |
发明人 |
OHNISHI, TOHRU;KOUNO, HITOSHI;TANIGUCHI, TOSHIYUKI;NAKASHIMA, KOJI;NAKATA, TOSHIYUKI;IMANISHI, TSUNETSUGU;NAKAO, KEIICHI |
分类号 |
H05K1/02;H01L23/36;H01L25/07;H01L25/18 |
主分类号 |
H05K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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