发明名称 WIRING BOARD FOR MOUNTING LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board for mounting a light emitting device capable of efficiently and reliably discharging heat, generated by the light emitting device mounted on the bottom of a cavity, to the outside and easily capable of retaining the emission efficiency of the light emitting device. <P>SOLUTION: The wiring board for mounting light-emitting element 1 includes a board body 2a, constituted of a plurality of ceramic layers (insulating layers) s1-s6 and provided with surfaces 3, 4, whose plan view is substantially square (rectangle), as well as a substrate body 2a having four sides of outside surfaces 5, a cavity 6a, opened on the surface 3 of the substrate body 2a and constituted of a bottom 7, on which the light emitting diode (light emitting device) L is mounted later, and a side surface 8, a ventilating passage f1 constituted of a suction port 22 opened on the outside surface 5 of the substrate body 2a, a ventilating port 20, communicated with the suction port 22 and formed in the substrate body 2a, and a discharging port 19, communicated with the ventilating port 20 and opened on the surface 3 of the substrate body 2a, and a conductor layer 17 formed at the side of the discharging port 19 in the inner wall surface of the ventilating port 20. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009267177(A) 申请公布日期 2009.11.12
申请号 JP20080116520 申请日期 2008.04.28
申请人 NGK SPARK PLUG CO LTD 发明人 HIRANO SATOSHI;TOYAMA YUTAKA
分类号 H01L33/48;H01L33/56;H01L33/60;H01L33/62;H01L33/64 主分类号 H01L33/48
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