发明名称 SUBSTRATE POSITIONING APPARATUS, SUBSTRATE PROCESSING APPARATUS, SUBSTRATE POSITIONING METHOD, AND SUBSTRATE PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a substrate positioning apparatus capable of performing accurate control of holding force and suppressing dispersion in the holding force, a substrate processing apparatus, a substrate positioning method, and a substrate processing method. <P>SOLUTION: The substrate positioning apparatus 3 positions a circuit board 100 by narrowing width between a pair of clamp members 33 and 34. At least one clamp member 34 includes: a base part 35; a movable part 37 supported by the base part 35 upward, capable of moving in a width narrowing direction for approaching the other clamp member 33 along the base part 35 and capable of depressing the circuit board 100; and a non-contact driving mechanism 6 for applying non-contact force which is force of one or more sorts selected from gas discharge force, gas suction force, magnetic repulsion force, and magnetic tension force to a space between the base part 35 and the movable part 37 to move the movable part 37 along the base part 35 in the width narrowing direction and position the circuit board 100. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2009267036(A) 申请公布日期 2009.11.12
申请号 JP20080114056 申请日期 2008.04.24
申请人 FUJI MACH MFG CO LTD 发明人 KONDO TAKESHI
分类号 H05K13/04;B41F15/08;B41F15/26 主分类号 H05K13/04
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