发明名称 LASER BEAM MACHINING APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a laser beam machining apparatus where, even if the using range of laser power is changed in accordance with application, adjusting resolution is not changed per the set range. <P>SOLUTION: The second input device 8b designates the rotational angle (the second set value) of a 1/2 wavelength plate 3. A control device 9 rotates the 1/2 wavelength plate 3 via a rotating device 6, and stepwise adjusts the power of the laser light outputted from a laser oscillator 2. The first input device 8a designates the power upper limit value (the first set value) of the powder of the laser light outputted from the laser oscillator 2. The control device 9 controls the driving of the laser oscillator 2 via a laser driving device 7, and adjusts the power of the laser light outputted from the laser oscillator 2. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2009262223(A) 申请公布日期 2009.11.12
申请号 JP20080118283 申请日期 2008.04.30
申请人 SUNX LTD 发明人 MORITA NAOKI
分类号 B23K26/00;B23K26/06;G02B26/02;G02B27/28 主分类号 B23K26/00
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