| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a colloidal silica useful for polishing electronic materials etc. <P>SOLUTION: The colloidal silica is manufactured by using: an active silicic acid water solution obtained by hydrolysis of tetraalkoxysilane; and at least one nitrogen-containing basic compound out of ethylenediamine, diethylenediamine, imidazole, methylimidazole, piperidine, morpholine, arginine, and hydrazine. The colloidal silica contains nonspherical silica particles, and has a pH of 8.5-11.0 at 25°C. The nonspherical silica particle is preferably a nonspherical heteromorphic particle-crowded silica particle whose major axis/minor axis ratio observed by transmission electron microscope is 1.2-20, and whose average value of major axis/minor axis ratio is 3-15. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
