| 摘要 |
On the both surfaces of a wiring board, connecting pad sections for connecting various types of circuit elements and a wiring pattern for connecting the connecting pad sections are arranged, and penetrating wiring sections for connecting the connecting pad sections and the wiring patterns on each surface are provided. A post electrode component is formed by integrally forming a plurality of post electrodes which are supported by a supporting section. A semiconductor chip is mounted on the rear surface of the wiring board and is connected to the connecting pad section on the rear surface. A post electrode component is fixed at a prescribed position on the wiring pattern and electrically connected to the wiring pattern, and after resin-sealing is performed, the supporting section is peeled and a post electrode end surface or the rear surface wiring connected to the post electrode end surface is exposed. Another circuit element is arranged on the connecting pad section on the front surface of the wiring board and connected to the connecting pad section. |
