| 摘要 |
Provided is a microchip manufacturing method by which a function film is formed in a channel and resin microchip substrates are bonded. The manufacturing method has a first step of forming SiO2 films (12, 22), i.e., the function films, on surfaces having channel grooves (11, 21) on a microchip substrate (10) having the channel groove (11) on the surface and on the microchip substrate (20) having the channel groove (21) on the surface; a second step of removing the SiO2 films other than the SiO2 films formed on the channel grooves (11, 21) on the microchip substrates (10, 20) by an adhesive member; and a third step of placing the microchip substrates (10, 20) one over another by having inside the surfaces whereupon the channel grooves (11, 21) are formed, and bonding the substrates by laser welding, ultrasonic welding or thermocompression bonding. |
